Henkel Technomelt PA 6344 Black Low Pressure Molding Hot Melt

Henkel Technomelt PA 6344 Black Low Pressure Molding Hot Melt Overview

Henkel TECHNOMELT® PA 6344 is a single-component polyamide hot melt adhesive specifically designed for low pressure molding applications. Its low viscosity allows for processing at reduced molding pressures, making it ideal for encapsulating delicate components without causing damage.

Upon application, TECHNOMELT® PA 6344 quickly solidifies, creating a protective barrier that shields electronics from environmental factors. This durable encapsulant offers excellent heat stability and moisture resistance, making it suitable for a wide range of applications, including potting electronic modules, molding strain reliefs into wiring, and encapsulating sensors. Its versatility extends to various substrates, including FR4, metals, and plastics such as ABS and PC.

Features and Benefits

• Easy Moldability: Simplifies processing, allowing for efficient and reliable encapsulation.
• Designed for Molding Applications: Specifically formulated to meet the demands of low pressure molding processes.
• UV Stability: Ensures long-lasting performance in UV-exposed environments.
• High Adhesion: Provides strong bonding to a variety of substrates, including challenging materials like ABS and PC.

Specifications

• Series: Technomelt PA 6344
• Type: Hot Melt
• Application: Molding
• Chemistry: Polyamide
• Components: One-Component
• Cure: Physical Setting
• Appearance: Black
• Application Temperature: 374°F to 446°F (190°C to 230°C)
• Working Temperature: 32°F to 212°F (0°C to 100°C) - Depends on Application, without Mechanical Stress
• Softening Point: 287.6°F (142°C)
• Melting Viscosity:
  • Approx. 18,000 cps @ 392°F (200°C)
  • Approx. 11,000 cps @ 410°F (210°C)
  • Approx. 7,000 cps @ 437°F (225°C)
  • Approx. 3,800 cps @ 464°F (240°C)
• Specific Gravity: 1.00 g/cm³
• Shore A Hardness: 80
• E-Modulus: 4,000 psi (27.6 N/mm²)
• Tensile at Break: 700 psi (4.8 N/mm²)
• Yield Strength: 350 psi (2.4 N/mm²)
• Elongation: 700%
• Temperature Creep Resistance: 248°F (120°C)
• Low Temperature Flexibility: 32°F (0°C)
• Glass Transition: 32°F (0°C)
• Water Absorption
  • One Day: 0.5% @ 73.4°F (23°C)
  • Seven Days: 1.4% @ 73.4°F (23°C)