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Biodegradable Hot Melt Adhesive for Automated Packaging
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Tecbond 110B is an innovative biodegradable automated packaging adhesive formulated for high-speed case sealing and carton closing. Its low-viscosity composition allows it to flow smoothly through narrow nozzles while operating at lower temperatures. This also reduces energy use without compromising adhesive strength. With a 10-second open time, this fast-setting case-sealing adhesive supports efficient end-of-line (EOL) packaging operations, making it ideal for manufacturers looking to enhance productivity while prioritizing sustainability.
Engineered to meet rigorous EN13432, ASTM D6400, ASTM D6954, and ASTM D6866 environmental certifications, the Tecbond 110B hot melt adhesive is designed to break down naturally when exposed to oxygen, UV light, and heat. Unlike traditional adhesives, it leaves no microplastics behind, providing an eco-conscious alternative for businesses seeking sustainable packaging solutions.
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Need samples of this product for testing? We offer free samples for qualifying applications.
We also have an in-house lab where we can perform adhesive testing on your behalf. If you would like to send samples of your substrates for lab testing, contact us to make arrangements.