Henkel Technomelt PA 673 Amber Low Pressure Molding Hot Melt

Henkel Technomelt PA 673 Amber Low-Pressure Molding Hot Melt

Henkel Technomelt PA 673 is an amber-colored, high-performance thermoplastic polyamide designed to meet low-pressure molding process requirements. This hot melt adhesive can be processed at low pressure due to its low viscosity, allowing encapsulation of fragile components without damage. Can be used in automotive underhood applications where high service temperature performance is critical - UL-listing (V-0).

Technomelt PA 673 solidifies to form a barrier between electronics and the environment. It is a resilient encapsulant with good heat stability and moisture resistance. Typical applications include potting electronics modules, molding strain relief into wiring, and encapsulation of sensors.

Features and Benefits

• Solvent-free
• Easy moldability
• Good adhesion to a variety of substrates
• Excellent moisture resistance
• Excellent environmental resistance
• Very short open time

Specifications

• Series: Technomelt PA 673
• Type: Hot Melt Adhesive
• Application: Molding
  
• Chemistry: Polyamide
• Components: One-Component
• Cure: Physical Setting
• Appearance: Amber
• Molding Temperature Range: 410°F to 465°F (210°C to 240°C)
  
• Operating Temperature Range: -40°F to 285°F (-40°C to 140°C)
  
• Softening Point: 359.6°F to 377.6°F (182°C to 192°C)
• Melting Viscosity:
  
  • Approx. 2,800 to 4,000 cps @ 410°F (210°C)
  • Approx. 2,500 cps @ 428°F (220°C)
  • Approx. 1,800 cps @ 446°F (230°C)
• Specific Gravity: 0.98 g/cm³
• Shore A Hardness: 90
• Yield Strength: 800 psi (4.9 N/mm²)
• Break Strength: 710 psi (5.5 N/mm²)
• Elongation: 400%
• E-Modulus: 9,400 psi (58 N/mm²)
• Temperature Creep Resistance: 320°F (160°C)
  
• Low Temperature Flexibility: -40°F (-40°C)
• Glass Transition: -49°F (-45°C)
• Flammability (UL 94): V-2