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Henkel Technomelt Supra 62 Packaging Hot Melt
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Henkel Technomelt Supra 62 Packaging Hot Melt
Product Highlights
- Type: Bulk Hot Melt
- Brand: Henkel Technomelt
- Hot Melt Type: Metallocene
- Temperature: High
- Set Speed: Fast
- Color: Light Yellow
- Bonds: General, Cardboard
- Properties: Food Safe
- Application: General Purpose, Packaging, Case and Carton Sealing, Tray Forming
Henkel Technomelt Supra 62 Packaging Hot Melt Overview
Technomelt Supra 62 is a premium metallocene hot melt adhesive tailored for food packaging applications, ideal for case, carton, and tray formation. This adhesive offers exceptional heat stability, minimal odor, and a light color, ensuring fast setting and high hot tack properties. It provides reliable adhesion across a variety of substrates used in packaging, maintaining strength and performance even under varying temperature conditions.
All ingredients in Technomelt Supra 62 are approved under Federal Regulation 21 CFR 175.105 for indirect contact with food.
Henkel Technomelt Supra 62 comes in a 30 lb. bag (roughly 14 kg).
Features and Benefits
- Excellent heat stability and resistance
- Low odor
- Light color
- Fast setting
- High hot tack
- Strong adhesion on various common substrates for cases, cartons, and trays at different temperatures
- Meets requirements of Indirect Food Additives Regulation 21 CFR 175.105
Specifications
- Series: Technomelt Supra 62
- Type: Hot Melt Adhesive
- Application: Packaging - Case, Carton, and Tray Formation
- Chemistry: Metallocene
- Appearance: White to Light Yellow
- Physical Shape: Pellets
- Solids: 100%
- Running Temperature Range: 325°F to 375°F (162.8°C to 190.6°C) - Recommended Application Temperature is 350°F (176.7°C)*
- Softening Point: Approx. 225°F (107.2°C)
- Viscosity, Brookfield: Approx. 700 to 1,050 cps @ 350°F (176.7°C)
- Density: 7.18 lb./gal.
- Certification: 21 CFR 175.105 for Indirect Contact with Food
- Shelf Life: 2 Years
- Package: 30 lb. (14 kg)
*Note: Although the recommended application temperature is 350°F (176.7°C), the specific application requirements may require customization.
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