Overtec 5FR Molding Resin Hot Melt Sticks

Power Adhesives Overtec FR 5 Hot Melt Adhesive

The Power Adhesives Overtec FR 5 is an incredibly unique hot melt that can be used in low-pressure molding. Low pressure molding with hot melt offers a number of unique advantages like a fast set time and low cost. 

Advantages of Low Pressure Molding with Overtec FR5

• Low impact that won't damage delicate parts
• Easy, fast dispensing
• Fast set time
• Low cost compared to other adhesives
• No shelf life issues
• Watertight encapsulation
• Great chemical resistance

While low pressure molding with hot melt won't replace epoxy and other adhesives in all applications, it shouldn't be overlooked as a fast, low cost alternative to more traditional methods of potting and encapsulating. 

Dispensing Overtec 5 FR Adhesive

Because of its unique melt temperature and characteristics, it is strongly recommended that Overtec 5 FR is dispensed with the Overtec hot melt glue gun. 

Specifications

• Brookfield viscosity (POW-12-VISC) spindle 27: 4800cps @ 375ºF, 2300cps @ 410ºF
• Ring & ball softening point (ATM E28): 316 ºF
• Heat resistance (BS5350 Part H3): 275 ºF
• Open time: Medium
• Low-temperature flexibility (tg): -30ºF
• Dielectric constant (1MhZ): 3.5
• Specific resistance: 3 x 10^12 cm
• Dielectric strength: 23 kV/mm

Resources

• Overtec FR 5 TDS

• Overtec FR 5 SDS