Power OverTEC 5 FR Molding Resin Hot Melt Sticks

Power Adhesives OverTEC FR5 Hot Melt Overview

The Power Adhesives OverTEC FR5 is an incredibly unique hot melt that can be used in low pressure molding. Low pressure molding with hot melt offers a number of unique advantages like fast set time and low cost. 

Advantages of Low Pressure Molding with OverTEC FR5

• Low impact that won't damage delicate parts
• Easy, fast dispensing
• Fast set time
• Low cost compared to other adhesives
• No shelf life issues
• Water tight encapsulation
• Great chemical resistance

While low pressure molding with hot melt won't replace epoxy and other adhesives in all applications, it shouldn't be overlooked as a fast, low cost alternative to more traditional methods of potting and encapsulating. 

Dispensing OverTEC 5 FR Hot Melt

Because of its unique melt temperature and characteristics, it is strongly recommended that OverTEC 5 FR is dispensed with the OverTEC hot melt glue gun. 

Specifications

• Brookfield viscosity (POW-12-VISC) spindle 27: 4800cps @ 375ºF, 2300cps @ 410ºF
• Ring & ball softening point (ATM E28): 316 ºF
• Heat resistance (BS5350 Part H3): 275 ºF
• Open time: Medium
• Low temperature flexibility (tg): -30ºF
• Dielectric constant (1MhZ): 3.5
• Specific resistance: 3 x 10^12 cm
• Dielectric strength: 23 kV/mm

Resources

• OverTEC FR5 TDS

• OverTEC FR5 SDS